Helps to achieve high efficiency, miniaturization, and lightweight of power electronic devices
High frequency hybrid SiC power semiconductor module begins to provide samples
Mitsubishi Electric Corporation will begin providing high-frequency mixed SiC power semiconductor samples on May 15th, with the diode part of the power semiconductor made of SiC ※ 1 material. By adopting silicon carbide (SiC) technology, it will be more helpful for power electronic devices such as uninterruptible power supplies (UPS), medical device dedicated power supplies, solar inverters, etc. to achieve high efficiency, miniaturization, and lightweight.
In addition, high-frequency hybrid SiC power semiconductor modules will be exhibited at the PCIM ※ 2 Europe 2014 exhibition (held in Nuremberg, Germany from May 20-22).
※ 1 SiliconCarbon: Silicon carbide
※2 PCIM:Power Conversion Intelligent Motion
High frequency hybrid SiC power semiconductor module
Characteristics of the new product
1. Reduce losses by about 40%, which helps to achieve high efficiency, miniaturization, and lightweight of the device
Adopting a hybrid structure of SiC SBD ※ 3 for diodes and Si IGBT for transistors in high-frequency switches.
SiC SBD, as it does not generate reverse recovery current, can significantly reduce switch losses by about 40%, thus helping to achieve high efficiency of the device.
Due to the significant reduction in losses, it will be beneficial for further miniaturization and lightweighting of heat dissipation devices, while high-frequency power devices will help achieve miniaturization and lightweighting of components such as reactors.
※ 3 Schottky Barrier Diode: Schottky Barrier Diode
2. The internal parasitic inductance is reduced, which can effectively suppress surge voltage
Adopting low inductance packaging suitable for high-speed switches.
Compared to previous products ※ 4, 100A and 150A products have reduced internal parasitic inductance by approximately 30%.
※ 4 High frequency IGBT module "NFH series" using silicon (Si)
3. Consistent with previous product packaging, convenient for users to replace
Ensuring packaging consistency with previous product ※ 4, it can be directly replaced.
Overview of the new product
Product Name | Model | Summary | Sample production date |
High frequency use Mixed SiC Power Semiconductor modular | CMH100DY-24NFH | 1200V/100A2in1 | 5月15日 |
CMH150DY-24NFH | 1200V/150A2in1 | ||
CMH200DU-24NFH | 1200V/200A2in1 | ||
CMH300DU-24NFH | 1200V/300A2in1 | ||
CMH400DU-24NFH | 1200V/400A2in1 | ||
CMH600DU-24NFH | 1200V/600A2in1 |
Purpose of providing samples
In recent years, from the perspective of efficient energy utilization, the use of power semiconductors made of silicon carbide (SiC) can significantly reduce power losses and achieve high-speed switching of power devices. Therefore, users' expectations for it are becoming increasingly urgent. Previously, for power electronic devices such as uninterruptible power supply (UPS) and medical device dedicated power supplies that require high-frequency switching operations, our company has provided the "NFH series" of power semiconductor modules with optimized switching characteristics.
Now, through further research and development, Mitsubishi Electric has begun to provide samples of hybrid silicon carbide (SiC) modules for high-frequency use. As a new lineup of the "NFH series", this module can significantly reduce power loss by using SiC SBD.
High frequency hybrid SiC power semiconductor modules are developed as part of the New Energy and Industrial Technology Development Organization (NEDO) technology.
Main specifications
Purpose | Model | Rated voltage | Rated current | Circuit | Package size (W)×(D) |
Industrial equipment | CMH100DY-24NFH | 1200V | 100A | 2in1 | 48×94mm |
CMH150DY-24NFH | 150A | ||||
CMH200DU-24NFH | 200A | 62×108mm | |||
CMH300DU-24NFH | 300A | ||||
CMH400DU-24NFH | 400A | 80×110mm | |||
CMH600DU-24NFH | 600A |
Environmental considerations
This product complies with the RoHS * 6 standard set by EU member states and does not contain mercury.
※5 RestrictionoftheuseofcertainHazardousSubstancesinelectricalandelectronicequipment
Manufacturing factory
Mitsubishi Electric Corporation Power Device Manufacturing Institute
1-1 Imasu Higashi 1-chome, Nishi ku, Fukuoka City, Fukuoka Prefecture 819-0192