Intelligent IGBT driver device with built-in micro isolator developed by Renesas Electronics

Intelligent IGBT driver device with built-in micro isolator developed by Renesas Electronics

On April 25, 2013, Tokyo, Japan - Renesas Electronics Corporation (TSE: 6723), a leading global semiconductor and solutions supplier, announced today the development of R2A25110KSP intelligent power devices with isolated IGBT drivers, suitable for power inverters in electric and hybrid vehicles. R2A25110KSP incorporates Renesas Electronics' latest micro isolator isolation technology. These technologies can establish more reliable and compact systems for automotive application systems.

The inverter used to drive motors in electric and hybrid vehicles includes a power module using motor drive components such as IGBT, and a control circuit module with isolation function between low-voltage drive electronics and high-voltage power electronics. The continuous growth of demand in the power inverter market has led to power modules becoming more compact in order to reduce the size, weight, and overall cost of the system. Therefore, the demand for integrated isolation components and IGBT driver circuit solutions is constantly increasing, in order to reduce the size of power modules to a greater extent and meet the growing requirements for improving performance and saving costs.

In response to this market demand, Renesas Electronics has developed the R2A25110KSP product.

The main functions of the latest R2A25110KSP

(1) A single package solution that integrates isolation technology and high-energy IGBT drivers, suitable for smaller printed circuit board (PCB) pin positions

R2A25110KSP has a built-in isolation device called a "miniature isolator", which is a proprietary isolation signal transmission technology of Renesas Electronics. It uses an air core transformer. This device is designed for automotive application systems operating at extreme ambient temperatures, with a rated channel temperature of 150 ° C (maximum). With low dispersion rate (referring to the situation where the range of characteristic curve values is small), the R2A25110KSP driver has fast switching ability and is suitable for improving the efficiency of motor drive application systems. In addition, compared with competing products, the driving capability of IGBT drivers is 2 to 4 times higher (impedance in the on state: 1.0 Ω maximum), which can directly achieve IGBT driving without using external transistors, reducing the use of external components, thus reducing the PCB pin area, and adopting a more compact inverter control circuit board design.

(2) Even when driving parallel IGBTs, comprehensive overcurrent and overtemperature protection can be achieved, enhancing excellent system reliability

IGBT devices are used in parallel as driving elements in inverter systems. In many HEV/EV application systems, two IGBT devices are connected in parallel to drive high-power motors. Therefore, the inverter system should detect abnormal conditions of two IGBTs, such as overcurrent and/or overheating, and avoid them. However, traditional IGBT drivers only have one overcurrent protection and/or over temperature protection. This requires a larger circuit board area.

R2A25110KSP integrates two methods to protect two IGBTs without increasing the circuit board area.

(3) IGBT chip temperature monitor can improve system stability

The IGBT chip temperature monitor can continuously monitor the temperature of two IGBTs and feedback the relevant information of the IGBT with higher temperature to the MCU through a micro isolator. Temperature can be calculated based on the duty cycle of the pulse.

Other integrated functions include active Miller clamp and soft turn off. Active Miller clamp can display fault shutdown when IGBT is in the off state. The soft turn off function can gradually turn off the IGBT when abnormal situations such as overcurrent occur. The IGBT turn off function can avoid overvoltage peaks caused by reduced inductance of wires and cables on the IGBT. These features can improve the cost-effectiveness of the product in terms of smaller system pins, better performance, and stronger stability.

Renesas is working hard to launch a production line for three-phase motors suitable for automotive application systems. Our company is expanding its effective sales efforts to integrate the overall solution with MCU and power devices. Renesas is also advancing the planning and development of future products for other "miniature isolators" in order to integrate other functions into the products and meet the isolation requirements of automotive systems.

Learn more about this product

Pricing and supply situation

The first batch of R2A25110KSP samples in the 38 pin SSOP package will be available for supply at the end of April 2013 at a price of $5 per unit. Mass production is expected to begin in the first half of 2015, with a production scale of 1 million units per month.

The isolated IGBT driver R2A25112KSP intelligent power device in the 20 pin SSOP package is expected to be supplied starting from December this year.

For the specifications of R2A25110KSP, please refer to the separate data sheet.

(Note)

All product and service names mentioned in this press release are trademarks or registered trademarks of their respective owners.



About Renesas Electronics Co., Ltd

Renesas Electronics Corporation (TSE: 6723) is a leading global supplier of microcontrollers and the preferred supplier of advanced semiconductor solutions. Its products include microcontrollers, SoC solutions, and various analog and power devices. In April 2010, NEC Electronics Corporation (TSE: 6723) merged with Renesas Technology Co., Ltd. to establish Renesas Electronics Co., Ltd. The company's business covers research, development, design, and manufacturing for various applications. Renesas Electronics Corporation is headquartered in Japan and has subsidiaries in over 20 countries worldwide. For more information, please visit the website: www.cn.renesas.com.